Liquid cooling principle of mobile phone chip: the liquid in the copper tube is heated at the heat source end, and even undergoes a phase change (the liquid in the copper tube is vaporized, which has not been proved, so it is doubtful whether it can happen), and thermal convection is formed in the heat pipe, which cools at the heat dissipation end and flows back to the heat source, etc., thus accelerating heat transfer. Cover the motherboard with a copper plate to conduct the heat emitted by the motherboard to the liquid-cooled copper tube in the middle, and one end of the copper tube extends into the sim card slot with relatively low temperature, so that the effect of cooling one end and heating the other end will naturally be good.

Current situation of liquid cooling of mobile phone chips;

At present, the "liquid cooling" used by most mobile phones can be directly understood as talking is better than nothing. When you can't suppress it, you can't suppress it. No matter how well you blow it, the heat dissipation efficiency is not high (just like a snake laptop). At present, heat dissipation technology and battery technology have the same bottleneck. Some manufacturers expand the space inside the machine, and some manufacturers install a small fan outside.