1. Laser cutting is based on "software and hardware cooperation and intelligent control", which combines the plane bus system FSCUT8000 with the molten pool detection and process monitoring technology of the intelligent cutting head to realize the bright spot functions such as rapid perforation, intelligent back cutting, seamless micro-connection and intelligent cutting, and further improve the production and processing efficiency of the equipment. By further optimizing the real-time centering algorithm, the special cutting path of special section steel is optimized, and high-precision machining in the field of section steel subdivision is realized on the basis of improving machining efficiency.

2. Bonding method in micro-connection technology In micro-connection technology, bonding method is mainly used for the connection of interconnection lines in solid-state circuits in microelectronic devices, that is, the connection between chips and lead frames.