▲ HP g4 10 16TX laptop waiting to be dismantled.
▲ The main fixing method of G4 is the back screw structure.
▲ Remove the screws and optical drive on the back, and remove the keyboard of g4.
▲g4 uses a chocolate keyboard.
▲ The keyboard of G4 is made by Quanta. There is no plastic film design on the back, but it is waterproof. Why? review
▲ The panel design under the keyboard is no different from that of a general notebook.
Dismantle the panel and motherboard, and arrange the materials reasonably.
Disassembly conclusion:
From the disassembly of the panel to the exposure of the motherboard, the waterproof film covered under the panel solved our previous suspicion that the keyboard was not waterproof, and this film also played a good anti-static role to avoid damaging the motherboard. The panel of G4 is very strong. Metal parts are used in the position of the optical drive to improve the overall firmness, and reinforcing ribs are also used under the palm rest to improve the compression resistance of the palm rest.
We also see the reinforcement of the bottom cover of the fuselage, which is very helpful to improve the overall protection ability of the notebook. The designer adopted a convex design around the integrated single motherboard, and sealed the heat dissipation path of the motherboard with the side wall of the bottom cover, which not only improved the heat dissipation efficiency of g4, but also protected the motherboard.
Judging from the materials used for the motherboard, it really conforms to the slogan of real materials put forward by HP this time, and the welding process, surface treatment and component quality are excellent in the g4 price range.
▲g4 panel
▲ From the back, you can see the metal protective cover of the CD-ROM drive, the ribs of the palm rest and the plastic film covering of the keyboard.
▲ Remove the palm rest panel g4 to see the integrated motherboard.
▲ Remove the stiffener design on the bottom cover of the motherboard g4, and you can clearly see the heat dissipation and exhaust design.
▲G4 motherboard front
▲ The back of G4 motherboard.
The monolithic design layout of the motherboard details is conducive to rapid heat conduction.
Disassembly conclusion: From the design of g4 single-chip motherboard, the designer's idea mainly focuses on rapid heat conduction, which avoids the problem that multi-chip motherboard with multiple heat sources causes the heat dissipation of the fuselage to be difficult to deal with. From the layout of each component, the discrete graphics card chip with high calorific value is closest to the cooling fan, so that the heat generated during its operation can be quickly exported, and the accumulation inside the fuselage will not lead to local high-heat areas. In addition, because the processor adopts Intel's second-generation 32nm Core processor, the reduction of overall calorific value is also one of the bases for designers to boldly use a single copper tube to dissipate heat. According to the thermal disassembly and test, g4' s reasonable overall heat dissipation design is the main reason for its excellent thermal test results.
▲ The distribution diagram of core components of G4 motherboard shows that a single display chip is closest to the cooling fan.
▲g4 motherboard as a whole
▲ The main interface of G4 is located at one side of the fuselage.
▲ There are only two main heat sources for details on the back of G4 motherboard.
▲ The front of G4 radiator is designed with a single copper tube.
▲ The heat dissipation design idea of g4 can be seen from the back. A single copper tube runs through the processor, and the unique display screen is closer to the fan, which is beneficial to heat dissipation.
List of core components and final conclusion
▲ Stick an antistatic plastic sticker on the back of the hard disk.
▲g4 adopts Seagate 640GB large-capacity 2.5-inch hard disk.
▲ In terms of memory, Samsung's 2GB DDR3 1333MHz high-speed memory is used.
▲g4' s wireless network card supports 802. 1 1b/g/n specification.
▲ sticker on the back of wireless network card
▲PCH chip: HM65
Disassembly conclusion:
1. In the process of disassembling the panel to expose the motherboard, the waterproof film covered under the panel solved our previous suspicion that the keyboard was not waterproof, and this film also played a good anti-static role to avoid damaging the motherboard. The panel of G4 is very strong. Metal parts are used in the position of the optical drive to improve the overall firmness, and reinforcing ribs are also used under the palm rest to improve the compression resistance of the palm rest. We also see the reinforcement of the bottom cover of the fuselage, which is very helpful to improve the overall protection ability of the notebook. The designer adopted a convex design around the integrated single motherboard, and sealed the heat dissipation path of the motherboard with the side wall of the bottom cover, which not only improved the heat dissipation efficiency of g4, but also protected the motherboard. Judging from the materials used for the motherboard, it really conforms to the slogan of real materials put forward by HP this time, and the welding process, surface treatment and component quality are excellent in the g4 price range.
2. From the design of g4 single-chip motherboard, the designer's idea mainly focuses on fast heat conduction, which avoids the problem that multi-chip motherboard with multiple heat sources causes the heat dissipation of the fuselage to be difficult to deal with. From the layout of each component, the discrete graphics card chip with high calorific value is closest to the cooling fan, so that the heat generated during its operation can be quickly exported, and there will be no accumulation inside the fuselage, resulting in local high-heat areas in the fuselage. In addition, because the processor adopts Intel's second-generation 32nm Core processor, the reduction of overall calorific value is also one of the bases for designers to boldly use a single copper tube to dissipate heat. According to the thermal disassembly and test, g4' s reasonable overall heat dissipation design is the main reason for its excellent thermal test results.