As an important part of electronic equipment, circuit board needs certain technological requirements to ensure the quality and performance of circuit board. The following are the process requirements of several common PCB boards:

1. Clarity requirements: PCB printed circuit board should be clear and accurate in size, and there are no problems such as exposed copper fracture, short circuit and open circuit.

2. Welding quality: The quality and molding of bonding pads and wires should meet relevant standards to ensure firm welding, and there are no problems such as cold welding, virtual welding and dripping welding in the welding process.

3. Banning tin steel mesh: In the manufacturing process, tin steel mesh should be banned to avoid leaving impurities in the printing process and affecting the printing quality.

4. Control the thickness error of PCB: The thickness error of PCB needs to be controlled within a reasonable range to ensure the stability of the shape.

5. Control the smoothness and luster of PCB surface: In the manufacturing process, special attention should be paid to the smoothness and luster of PCB circuit board surface to avoid uneven or foreign bodies on the surface, which will lead to thickness deviation or other quality problems.

6. Control the displacement and deformation of PCB;

The manufacturing of PCB circuit board should ensure that the displacement and deformation of the board tend to zero, otherwise the components and connecting wires on the circuit board will fall off or be damaged, which will affect the service life and performance of the whole electronic equipment.

In short, in the manufacturing process of PCB, in addition to the above points, it is necessary to strictly control the quality and technology of each link in combination with specific application requirements and standards to ensure the quality and performance of PCB.